Evaluation of the thermal stability of reactively sputtered (Ti, Zr)Nx nano-thin films as diffusion barriers between Cu and Silicon

✍ Scribed by Yu-Lin Kuo; Chiapyng Lee; Jing-Cheng Lin; Yee-Wen Yen; Wen-Horng Lee

• Book ID: 108287825
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 408 KB
• Volume: 484
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2005.02.025