Thermal stability, adhesion and electrical studies on (Ti,Zr)Nxthin films as low resistive diffusion barriers between Cu and Si

✍ Scribed by C. Huang; C. Lai; P. Tsai; Y. Kuo; J. Lin; C. Lee

• Book ID: 124149021
• Publisher: The Korean Institute of Metals and Materials
• Year: 2014
• Tongue: English
• Weight: 585 KB
• Volume: 10
• Category: Article
• ISSN: 1738-8090
• DOI: 10.1007/s13391-013-3145-8