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Calibration of residual stress difference of MetalMUMPs silicon nitride films

โœ Scribed by J. S. Chang; Siyuan He; X. Wang

Book ID
106185881
Publisher
Springer-Verlag
Year
2010
Tongue
English
Weight
460 KB
Volume
16
Category
Article
ISSN
0946-7076

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โœ Siyuan He; John S. Chang; Lihua Li; Hsu Ho ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 1005 KB

Metal multi-user MEMS processes (MetalMUMPs) offered by MEMSCAP provide a 20 m thick electroplated nickel film suitable for constructing micro RF tunable capacitors, RF inductors, relays, switches, etc. Currently the Young's modulus and the residual stress gradient of the MetalMUMPs nickel film have