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C-axis orientation of Co-Cr thin films by facing targets sputtering

โœ Scribed by Niimura, Y.; Nakagawa, S.; Naoe, M.


Book ID
114648245
Publisher
IEEE
Year
1986
Tongue
English
Weight
516 KB
Volume
22
Category
Article
ISSN
0018-9464

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Preparation of aluminum thin films by th
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The facing targets sputtering (FTS) system, typical of plasma-free sputtering systems, was used to deposit aluminum thin films composed of very fine grains with a smooth surface, large hardness and low resistivity. When the argon gas pressure PAr was as low as 10-' Pa, the aluminum films deposited a