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Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices

✍ Scribed by N. H. Zhu; Y. Liu; S. J. Zhang; J. M. Wen

Publisher: John Wiley and Sons
Year: 2005
Tongue: English
Weight: 177 KB
Volume: 48
Category: Article
ISSN: 0895-2477
DOI: 10.1002/mop.21266

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