Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co-based amorphous wires

✍ Scribed by Liu, Jing-Shun ;Sun, Jian-Fei ;Xing, Da-Wei ;Xue, Xiang ;Zhang, Shu-Ling ;Wang, Huan ;Wang, Xiao-Dong

• Publisher: John Wiley and Sons
• Year: 2010
• Tongue: English
• Weight: 474 KB
• Volume: 208
• Category: Article
• ISSN: 0031-8965
• DOI: 10.1002/pssa.201026351

✦ Synopsis

Abstract

In order to study the effect of wire bonding by Cu electroplating on giant magneto‐impedance (GMI) stability of microwires for potential sensor application. The electroplated microstructure was observed by scanning electron microscopy (SEM) and GMI was studied by a precision impedance analyzer placed in a magnetically shielded space. Experimental results indicated that after electroplating at a current intensity of 395.0 A/dm^2^ holding for 60 s with a two‐terminal electroplated length of 4 mm of the microwire, the Cu layer with a homogeneous and compact granular structure has higher adhesive strength between the wire and the Cu layer, better wettability between wire and SAC, lower contact resistance and coefficient of thermal expansion (CTE). Consequently, the wire bonding by Cu electroplating could enhance the conductivity and impedance stability under different applied field. It can, therefore, be concluded that the wire bonding by a Cu electroplating technique is suitable for electronic packaging for sensor applications.