Front Cover: Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co-based amorphous wires (Phys. Status Solidi A 3/2011)

Experimental study on the effect of wire

Experimental study on the effect of wire bonding by Cu electroplating on GMI stability of Co-based amorphous wires

✍ Liu, Jing-Shun ;Sun, Jian-Fei ;Xing, Da-Wei ;Xue, Xiang ;Zhang, Shu-Ling ;Wang, 📂 Article 📅 2010 🏛 John Wiley and Sons 🌐 English ⚖ 474 KB

## Abstract In order to study the effect of wire bonding by Cu electroplating on giant magneto‐impedance (GMI) stability of microwires for potential sensor application. The electroplated microstructure was observed by scanning electron microscopy (SEM) and GMI was studied by a precision impedance a