Atomic layer deposited WNxCy films growth on SiC surfaces
โ Scribed by A. Martin Hoyas; C.M. Whelan; J. Schuhmacher; K. Maex; J.P. Celis
- Book ID
- 104051556
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 138 KB
- Volume
- 83
- Category
- Article
- ISSN
- 0167-9317
No coin nor oath required. For personal study only.
โฆ Synopsis
The growth of tungsten nitride carbide, WN x C y , films obtained by atomic layer deposition (ALD), using tri-ethylboron, tungsten hexafluoride and ammonia precursors is determined by the density and type of substrate reactive sites. During an initial period, referred to as transient regime, the SiC oxidation state and the tri-ethylboron pulse time determine the amount of metal deposited. WN x C y growth on SiC is similar to that on PECVD SiO 2 explained by decomposition of the tri-ethylboron precursor, giving rise to a carbon rich WN x C y -oxide interface.
๐ SIMILAR VOLUMES
## Abstract The growth of ultraโthin TaโN films using atomic layer deposition (ALD) is investigated by inโsitu Xโray photoelectron spectroscopy (XPS) starting from the first precursor pulse, as precursor substances __tert__โbutylimidoโtris(diethylamido)tantalum (TBTDET) and __tert__โbutylimidoโbis(
A1203-films deposited by atomic layer epitaxy onto silicon wafers were investigated structurally and electrically. A post-deposition anneal at 900ยฐC resulted in a decrease in film thickness of about 10% and an increase in the index of refraction of about 3%. The densification did not significantly i