✦ LIBER ✦

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

✍ Scribed by M. J. Yim; H -J. Kim; K. -W. Paik

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Some optimum processing properties for a

✍ S. H MANNAN; D. J WILLIAMS; D. C WHALLEY 📂 Article 📅 1997 🏛 Springer US 🌐 English ⚖ 518 KB

Flip chip attachment using anisotropic c

✍ Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. 📂 Article 📅 1997 🏛 IEEE ⚖ 176 KB

Plasma cleaning of the flex substrate fo

✍ M. A. Uddin; M. O. Alam; Y. C. Chan; H. P. Chan 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 905 KB

High Thermal Conduction Package Technolo

✍ Kohara, M.; Shin Nakao; Tsutsumi, K.; Shibata, H.; Nakata, H. 📂 Article 📅 1983 🏛 IEEE 🌐 English ⚖ 789 KB

Microwave preheating of anisotropic cond

✍ Rashed Adnan Islam; Y. C. Chan 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 620 KB

Reliability of Conductive Adhesives as a

✍ Jong-Woong Kim; Young-Chul Lee; Seung-Boo Jung 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 485 KB