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Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications

✍ Scribed by Jong-Woong Kim; Young-Chul Lee; Seung-Boo Jung

Book ID: 107454990
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 485 KB
Volume: 37
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0252-z

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