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[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - Addendum "Effect Of Bump Height On Flip-chip Joint Reliability Using ACA"

✍ Scribed by Persson, K.; Lai, Z.; Zribi, A.; Liu, J.; Willander, M.

Book ID: 126627326
Publisher: IEEE
Year: 1998
Weight: 55 KB
Category: Article
ISBN-13: 9780780349346
DOI: 10.1109/ADHES.1998.742058

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