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[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - Anisotropic conductive paste available for flip chip

✍ Scribed by Kishimoto, Y.; Hanamura, K.

Book ID: 126482993
Publisher: IEEE
Year: 1998
Weight: 880 KB
Category: Article
ISBN-13: 9780780349346
DOI: 10.1109/ADHES.1998.742016

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