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[IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 - Espoo, Finland (18-21 June 2000)] 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) - One-part fast cure chipbonder epoxy adhesives for electronic applications

✍ Scribed by Figovsky, O.; Sklyarsky, L.; Sklyarsky, O.

Book ID: 120299589
Publisher: IEEE
Year: 2000
Weight: 221 KB
Category: Article
ISBN-13: 9780780364608
DOI: 10.1109/ADHES.2000.860581

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