✦ LIBER ✦

Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

✍ Scribed by M. A. Uddin; M. O. Alam; Y. C. Chan; H. P. Chan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microwave preheating of anisotropic cond

✍ Rashed Adnan Islam; Y. C. Chan 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 620 KB

Effects of bonding temperature on the pr

✍ J.S. Hwang; M.J. Yim; K.W. Paik 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 391 KB

Research on the contact resistance, reli

✍ J. H. Zhang; Y. C. Chan 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 406 KB

Effects of epoxy functionality on the pr

✍ J. S. Hwang; M. J. Yim; K. W. Paik 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 193 KB