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Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

✍ Scribed by Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.

Book ID: 114560608
Publisher: IEEE
Year: 1997
Weight: 176 KB
Volume: 20
Category: Article
ISSN: 1083-4400
DOI: 10.1109/3476.622879

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