✦ LIBER ✦
Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS
✍ Scribed by Oh, K.W.; Ahn, C.H.; Roenker, K.P.
- Book ID
- 117866252
- Publisher
- IEEE
- Year
- 1999
- Tongue
- English
- Weight
- 483 KB
- Volume
- 5
- Category
- Article
- ISSN
- 1077-260X
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