Analysis of depth redistribution of implanted Fe near SiO2/Si interface
β Scribed by Hoshino, Y.; Yokoyama, A.; Yachida, G.; Nakata, J.
- Book ID
- 120486454
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 520 KB
- Volume
- 314
- Category
- Article
- ISSN
- 0168-583X
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In microelectronics, during fabrication of ultrashallow p-n junctions boron is implanted in a silicon monocrystal. However, the subsequent rapid thermal annealing (RTA) causes anomalous fast diffusion (transient enhanced diffusion, TED) of the boron inwards in the crystal, hindering the formation of
We have measured depth profiles of N isotopes by Rutherford backscattering spectrometry (RBS) and nuclear reaction analysis (NRA) before and after implantation of 100 keV N isotopes into Si 3 N 4 films on SiO 2 -glass substrates, which were prepared by using RF-magnetron-reactive-sputtering depositi