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Analysis of depth redistribution of implanted Fe near SiO2/Si interface

✍ Scribed by Hoshino, Y.; Yokoyama, A.; Yachida, G.; Nakata, J.


Book ID
120486454
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
520 KB
Volume
314
Category
Article
ISSN
0168-583X

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In microelectronics, during fabrication of ultrashallow p-n junctions boron is implanted in a silicon monocrystal. However, the subsequent rapid thermal annealing (RTA) causes anomalous fast diffusion (transient enhanced diffusion, TED) of the boron inwards in the crystal, hindering the formation of

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