An Introduction to Microelectromechanical Systems Engineering

✍ Scribed by Nadim Maluf, Kirt Williams

• Publisher: Artech House Publishers
• Year: 2004
• Tongue: English
• Leaves: 304
• Edition: 2
• Category: Library

✦ Synopsis

I have an interest in MEMS sensors and R&D efforts in such sensors, but little background in semiconductor processes. This book was a quick and painless introduction to the MEMS field from end to end. Complements and introduces the "handbooks" and their contents rather well.

✦ Table of Contents

Cover......Page 1
Table of Contents......Page 8
Foreword......Page 14
Preface......Page 16
Preface to First Edition......Page 20
The Promise of Technology......Page 22
What Are MEMS or MST?......Page 23
What Is Micromachining?......Page 24
Applications and Markets......Page 25
To MEMS or Not To MEMS?......Page 28
The Psychological Barrier......Page 29
Journals, Conferences, and Web Sites......Page 30
Summary......Page 32
Silicon-Compatible Material System......Page 34
Other Materials and Substrates......Page 42
Important Material Properties and Physical Effects......Page 45
Summary......Page 52
CHAPTER 3 Processes for Micromachining......Page 54
Basic Process Tools......Page 55
Advanced Process Tools......Page 76
Nonlithographic Microfabrication Technologies......Page 84
Combining the Tools Examples of Commercial Processes......Page 89
Summary......Page 95
General Design Methodology......Page 100
Techniques for Sensing and Actuation......Page 102
Passive Micromachined Mechanical Structures......Page 106
Sensors and Analysis Systems......Page 110
Actuators and Actuated Microsystems......Page 137
Summary......Page 149
Imaging and Displays......Page 154
Fiber-Optic Communication Devices......Page 162
Summary......Page 186
Microfluidics for Biological Applications......Page 190
DNA Analysis......Page 193
Microelectrode Arrays......Page 203
Summary......Page 206
Signal Integrity in RF MEMS......Page 210
Passive Electrical Components: Capacitors and Inductors......Page 211
Microelectromechanical Resonators......Page 221
Microelectromechanical Switches......Page 232
Summary......Page 235
CHAPTER 8 Packaging and Reliability Considerations for MEMS......Page 238
Key Design and Packaging Considerations......Page 239
Die-Attach Processes......Page 246
Wiring and Interconnects......Page 248
Types of Packaging Solutions......Page 254
Quality Control, Reliability, and Failure Analysis......Page 264
Summary......Page 277
Glossary......Page 282
About the Authors......Page 292
Index......Page 294