✦ LIBER ✦

Advances in Wafer Level Packaging (WLP)

✍ Scribed by Tong Yan Tee; Xuejun Fan; Yi-Shao Lai

Book ID: 108210868
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 102 KB
Volume: 50
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2010.02.012

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