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Advanced silver-based metallization patterning for ULSI applications

✍ Scribed by T.L. Alford; Phucanh Nguyen; Yuxiao Zeng; J.W. Mayer

Book ID
108411143
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
612 KB
Volume
55
Category
Article
ISSN
0167-9317

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Copper-based metallization for ULSI circ
Copper-based metallization for ULSI circuits
✍ J. Torres; J.L. Mermet; R. Madar; G. Crean; T. Gessner; A. Bertz; W. Hasse; M. P πŸ“‚ Article πŸ“… 1996 πŸ› Elsevier Science 🌐 English βš– 237 KB

The feasibility of copper metallization for interconnections in ultra-large scale integrated circuits is under evaluation in the ESPRIT/JESSI project COIN (Copper INterconnections). Research has been performed comprising all basic aspects of copper metallization for integrated circuits, such as deve