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Advanced Packaging


Year
2005
Tongue
English
Leaves
42
Category
Library

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Introduction to MEMS --<br/> Advanced MEMS packaging --<br/> Enabling technologies for advanced MEMS packaging --<br/> Advanced MEMS wafer-level packaging --<br/> Optical MEMS packaging : communications --<br/> Optical MEMS packaging : bubble switch --<br/> Optical MEMS : microbolometer packag

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<p><p><i>Advanced Flip Chip Packaging</i> presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the