Advanced Flip Chip Packaging

✍ Scribed by Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)

• Publisher: Springer US
• Year: 2013
• Tongue: English
• Leaves: 562
• Edition: 1
• Category: Library

✦ Synopsis

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

✦ Table of Contents

Front Matter....Pages i-vii
Market Trends: Past, Present, and Future....Pages 1-21
Technology Trends: Past, Present, and Future....Pages 23-52
Bumping Technologies....Pages 53-84
Flip-Chip Interconnections: Past, Present, and Future....Pages 85-154
Flip Chip Underfill: Materials, Process, and Reliability....Pages 155-199
Conductive Adhesives for Flip-Chip Applications....Pages 201-261
Substrate Technology....Pages 263-339
IC-Package-System Integration Design....Pages 341-412
Thermal Management of Flip Chip Packages....Pages 413-469
Thermo-mechanical Reliability in Flip-Chip Packages....Pages 471-501
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints....Pages 503-560

✦ Subjects

Electronics and Microelectronics, Instrumentation; Circuits and Systems; Optical and Electronic Materials