Advanced MEMS packaging

✍ Scribed by John H. Lau ... [et al.]

Publisher: McGraw-Hill
Year: 2010
Tongue: English
Leaves: 577
Edition: English
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Introduction to MEMS --

Advanced MEMS packaging --

Enabling technologies for advanced MEMS packaging --

Advanced MEMS wafer-level packaging --

Optical MEMS packaging : communications --

Optical MEMS packaging : bubble switch --

Optical MEMS : microbolometer packaging --

Bio-MEMS packaging --

Biosensor packaging --

Accelerometer packaging --

Radiofrequency MEMS switches --

RF MEMS tunable capacitors and tubable band-pass filters --

Advanced packaging of RF MEMS devices

📜 SIMILAR VOLUMES

Advanced MEMS Packaging (Electronic Engi

📁 Advanced MEMS Packaging (Electronic Engineering)

✍ John Lau, Cheng Lee, C. Premachandran, Yu Aibin 📂 Library 📅 2009 🌐 English

A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide present

ADVANCED PACKAGING

📁 ADVANCED PACKAGING

📂 Library 📅 2004 🌐 English

Advanced Packaging

📁 Advanced Packaging

📂 Library 📅 2005 🌐 English

Semiconductor Advanced Packaging

📁 Semiconductor Advanced Packaging

✍ John H. Lau 📂 Library 📅 2021 🏛 Springer 🌐 English

<span>The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth stu

Advanced Electronic Packaging

📁 Advanced Electronic Packaging

✍ Ulrich R.K., Brown W.D. (Ed.) 📂 Library 🌐 English

Second Edition, IEEE Press - Wiley, 2006, 812 pages, ISBN-13 978-0-471-46609-X, ISBN-IO 0-471-46609-3<div class="bb-sep"></div>This book reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition i

Materials for Advanced Packaging

📁 Materials for Advanced Packaging

✍ Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.) 📂 Library 📅 2009 🏛 Springer US 🌐 English

<p><P>Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packagin