<p>Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEM
Adhesion Aspects in MEMS/NEMS
โ Scribed by S H Kim; M T Dugger; K L Mittal
- Publisher
- CRC Press
- Year
- 2011
- Tongue
- English
- Leaves
- 424
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be Read more...
โฆ Table of Contents
Content: Front Cover; Contents; Preface; Part 1: Understanding Through Continuum Theory; Numerical Analysis of Contact Mechanics between a Spherical Slider and a Flat Disk with Low Roughness Considering Lennard-Jones Surface Forces; Equilibrium Vapor Adsorption and Capillary Force: Exact Laplace-Young Equation Solution and Circular Approximation Approaches; Which Fractal Parameter Contributes Most to Adhesion?; Effects of Contacting Surfaces on MEMS Device Reliability; A van der Waals Force-Based Adhesion Model for Micromanipulation; Part 2: Computer Simulation of Interfaces. Lattice Gas Monte Carlo Simulation of Capillary Forces in Atomic Force MicroscopyLarge Scale Molecular Dynamics Simulations of Vapor Phase Lubrication for MEMS; Atomistic Factors Governing Adhesion between Diamond, Amorphous Carbon and Model Diamond Nanocomposite Surfaces; Part 3: Adhesion and Friction Measurements; Theoretical and Experimental Study of the Influence of AFM Tip Geometry and Orientation on Capillary Force; Odd-Even Effects in the Friction of Self-Assembled Monolayers of Phenyl-Terminated Alkanethiols in Contacts of Different Adhesion Strengths. The Pull-Off Force and the Work of Adhesion: New Challenges at the NanoscaleInterfacial Adhesion between Rough Surfaces of Polycrystalline Silicon and Its Implications for M/NEMS Technology; Effect of Air-Plasma Pre-treatment of Si Substrate on Adhesion Strength and Tribological Properties of a UHMWPE Film; Part 4: Adhesion in Practical Applications; A Review of Adhesion in an Ohmic Microswitch; Characterization of Gold-Gold Microcontact Behavior Using a Nanoindenter Based Setup; Characterization and Adhesion of Interacting Surfaces in Capacitive RF MEMS Switches Undergoing Cycling. Molecular Mobility and Interfacial Dynamics in Organic Nano-electromechanical Systems (NEMS)Part 5: Adhesion Mitigation Strategies; Microscale Friction Reduction by Normal Force Modulation in MEMS; Microchannel Induced Surface Bulging of a Soft Elastomeric Layer; Fabrication of Novel Superhydrophobic Surfaces and Water Droplet Bouncing Behavior -Part 1: Stable ZnO-PDMS Superhydrophobic Surface with Low Hysteresis Constructed Using ZnO Nanoparticles; Plasma Modification of Polymer Surfaces and Their Utility in Building Biomedical Microdevices.
Abstract: Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface
๐ SIMILAR VOLUMES
<p>The fabrication of MEMS has been predominately achieved by etching the polysilicon material.ย However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the infor
This is a fine books that presents a basic foundation for MEMS modeling. However, I have few critiques about it: 1- It does not discuss magnetostriction modeling. 2- It does not discuss electro-thermal-elastic modeling (Current causes Joule heating, causing deflection). 3- It does not discuss elec