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Accurate metallization capacitances for integrated circuits and packages

✍ Scribed by Ruehli, A.E.; Brennan, P.A.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Capacitance models for integrated circui

✍ Ruehli, A.E.; Brennan, P.A. 📂 Article 📅 1975 🏛 IEEE 🌐 English ⚖ 644 KB

Aluminum alloy metallization for integra

✍ P.B. Ghate 📂 Article 📅 1981 🏛 Elsevier Science 🌐 English ⚖ 674 KB

Three dimensional metallization for vert

✍ P. Ramm; D. Bollmann; R. Braun; R. Buchner; U. Cao-Minh; M. Engelhardt; G. Errma 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 601 KB

Application of Ti: W barrier metallizati

✍ P.B. Ghate; J.C. Blair; C.R. Fuller; G.E. McGuire 📂 Article 📅 1978 🏛 Elsevier Science 🌐 English ⚖ 639 KB

Metallization for integrated circuits us

✍ Widmann, D.W. 📂 Article 📅 1976 🏛 IEEE 🌐 English ⚖ 866 KB

Electrical Characterization of Packages

✍ Stanghan, C.; MacDonald, B. 📂 Article 📅 1985 🏛 IEEE 🌐 English ⚖ 920 KB