## Abstract In this paper, novel and accurate closed‐form expressions are proposed which represent the per‐unit‐length line‐coupling parameters (mutual impedance and mutual admittance) of coupled on‐chip microstrip interconnects on lossy silicon substrate. The frequency‐dependent mutual admittance
Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate
✍ Scribed by Weisshaar, A.; Hai Lan, ; Luoh, A.
- Book ID
- 120234924
- Publisher
- IEEE
- Year
- 2002
- Tongue
- English
- Weight
- 834 KB
- Volume
- 25
- Category
- Article
- ISSN
- 1521-3323
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A new analytic model is presented to calculate the frequency-dependent distributed self and mutual inductance and the associated distributed series resistance of silicon semiconducting IC interconnects. The method is based on the induced current density distribution inside silicon substrate. The val
## Abstract A new closed‐form expression to calculate frequency‐dependent distributed inductance and the associated distributed series resistance of microstrip lines on a lossy silicon substrate (CMOS technology) are presented. The proposed analytic model for series impedance is based on a self‐con
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