𝔖 Bobbio Scriptorium
✦   LIBER   ✦

A TEM analysis of the Si3N4/Si3N4joint brazed with a Cu-Zn-Ti filler metal

✍ Scribed by J. Zhang; C. F. Liu; M. Naka; Q.C. Meng; Y. Zhou

Book ID
111590545
Publisher
Springer
Year
2004
Tongue
English
Weight
318 KB
Volume
39
Category
Article
ISSN
0022-2461

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Effect of Ti content on microstructure a
Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu–Pd–Ti filler metals
✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science 🌐 English βš– 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin