✦ LIBER ✦

A sub-micron BiCMOS technology for telecommunications

✍ Scribed by R. Hadaway; P. Kempf; P. Schvan; M. Rowlandson; V. Ho; J. Kolk; B. Tait; D. Sutherland; G. Jolly; I. Emesh

Publisher: Elsevier Science
Year: 1991
Tongue: English
Weight: 216 KB
Volume: 15
Category: Article
ISSN: 0167-9317
DOI: 10.1016/0167-9317(91)90273-g

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Advanced planarized passivation for sub-

Advanced planarized passivation for sub-micron technology

✍ Choon Kun Ryu; Judy Huang 📂 Article 📅 1999 🏛 Elsevier Science 🌐 English ⚖ 350 KB

An advanced passivation gap-fill process was developed for sub-micron technology. Excellent gap-fill was achieved using the stack of triethoxyfluorosilane (TEFS) doped fluoro-silicate (FSG) and silicon nitride films. This TEFS-based gap-fill process provides both high throughput and cost-effective p

Improved tungsten absorber technology fo

Improved tungsten absorber technology for sub-half-micron x-ray lithography

✍ H. Luethje; M. Harms; A. Bruns; U. Mackens 📂 Article 📅 1987 🏛 Elsevier Science 🌐 English ⚖ 356 KB

Design solutions for the interconnection

Design solutions for the interconnection parasitic effects in deep sub-micron technologies

✍ L. Baldi; B. Franzini; D. Pandini; R. Zafalon 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 453 KB

A sub-micron photoluminescence system fo

A sub-micron photoluminescence system for nanostructure characterization

✍ M. De Vittorio; C. Turco; R. Rinaldi; A. Melcarne; R. Cingolani 📂 Article 📅 2000 🏛 Elsevier Science 🌐 English ⚖ 561 KB

We have developed a local probe technique in order to investigate single quantum confined nanostructures. In our p-photoluminescence (~t-PL) setup the laser probe is focused on the sample surface by a long working distance microscope objective and the photoluminescence of the sample is collected in

Overview of Cu contamination during inte

Overview of Cu contamination during integration in a dual damascene architecture for sub-quarter micron technology

✍ J Torres; J Palleau; F Tardif; H Bernard; A Beverina; P Motte; R Pantel; M Juhel 📂 Article 📅 2000 🏛 Elsevier Science 🌐 English ⚖ 510 KB

A detailed study of copper contaminating steps performed during integration of multilevel Cu metallisation in dual damascene architecture has been performed. Contamination at the wafer back and the bevel edge should make it difficult to use the same equipment for conventional technology and new copp

A matrix approach for telecommunications

A matrix approach for telecommunications technology selection

✍ Kyeongtaek Kim; Kwangman Park; Seungwoo Seo 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 229 KB

Global competitive environment in telecommunications requires that the current R&D project selection process should be changed. This paper argues that quality function deployment(QFD) matrix that has been successfully used for drawing technologies from customer needs can be applied to the selection