✦ LIBER ✦

A study on wafer level vacuum packaging for MEMS devices

✍ Scribed by Lee, Byeungleul; Seok, Seonho; Chun, Kukjin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fabrication and Testing of a Wafer-Level

✍ Premachandran, C.S.; Ser Choong Chong, ; Liw, S.; Nagarajan, R. 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 783 KB

Titanium-Based Getter Solution for Wafer

✍ Vivek Chidambaram, Xie Ling, Chen Bangtao 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 364 KB

Device-Level Vacuum Packaging for RF MEM

✍ Shahriar Rahman, M.; Chitteboyina, M.M.; Butler, D.P.; Çelik-Butler, Z.; Pachec 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 834 KB

Selective bonding and encapsulation for

✍ Yi Tao; Ajay P Malshe; William D Brown 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 422 KB

Electrical Modeling and Design of a Wafe

✍ Perruisseau-Carrier, J.; Mazza, M.; Jourdain, A.; Skrivervik, A.K.; Ionescu, A.M 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 800 KB

A study on effect of wafer bow in wafer-

✍ Seonho Seok, Janggil Kim 📂 Article 📅 2013 🏛 Springer-Verlag 🌐 English ⚖ 423 KB