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A Model for Effect of Colloidal Forces on Chemical Mechanical Polishing

✍ Scribed by Mazaheri, Ali R.; Ahmadi, Goodarz

Book ID
124062649
Publisher
The Electrochemical Society
Year
2003
Tongue
English
Weight
186 KB
Volume
150
Category
Article
ISSN
0013-4651

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πŸ“œ SIMILAR VOLUMES

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A fundamental model proposed for material removal in chemical–mechanical polishing
✍ J. Xin; W. Cai; J.A. Tichy πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 431 KB

So far there is no consensus on the fundamental mechanism of material removal in chemical-mechanical polishing (CMP). Some researchers model the CMP process based on the mechanism proposed by Kaufman et al. [1], who attribute the material removal from the wafer surface to chemistry-aided mechanical