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4691287 IC device and a system for testing the same

✍ Scribed by Soichi Suzuki; Mitsuo Aihara; Mitsuo Fujii


Publisher
Elsevier Science
Year
1988
Tongue
English
Weight
92 KB
Volume
28
Category
Article
ISSN
0026-2714

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## Abstract We describe a novel inspection system based on the application of the stereo technique to the detection of defects related to the three‐dimensional (3D) profile of IC wire bonds. In our single‐camera–based setup, stereo views are obtained by rotating the IC chip under the CCD camera wit