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3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

✍ Scribed by Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C.

Book ID: 119782104
Publisher: IEEE
Year: 2001
Tongue: English
Weight: 722 KB
Volume: 89
Category: Article
ISSN: 0018-9219
DOI: 10.1109/5.929647

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