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Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

✍ Scribed by Y. K. Jee; J. Yu; K. W. Park; T. S. Oh

Book ID: 107455367
Publisher: Springer US
Year: 2009
Tongue: English
Weight: 637 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-008-0646-6

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