𝔖 Bobbio Scriptorium
✦   LIBER   ✦

What is 3D IC and what are the design challenges for 3D ICs?

✍ Scribed by Xie, Yuan

Book ID
125450878
Publisher
Association for Computing Machinery
Year
2009
Weight
20 KB
Volume
39
Category
Article
ISSN
0163-5743

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Design for High Performance, Low Power,
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits || Multi-objective Architectural Floorplanning for 3D IC
✍ Lim, Sung Kyu πŸ“‚ Article πŸ“… 2012 πŸ› Springer New York 🌐 English βš– 638 KB

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous β€œmanufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered

Design for High Performance, Low Power,
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits || Thermal-Aware Gate-Level Placement for 3D IC
✍ Lim, Sung Kyu πŸ“‚ Article πŸ“… 2012 πŸ› Springer New York 🌐 English βš– 1015 KB

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous β€œmanufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered