✦ LIBER ✦

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits || Multi-objective Architectural Floorplanning for 3D IC

✍ Scribed by Lim, Sung Kyu

Book ID: 121004959
Publisher: Springer New York
Year: 2012
Tongue: English
Weight: 638 KB
Edition: 2012
Category: Article
ISBN: 1441995420
DOI: 10.1007/978-1-4419-9542-1_10

No coin nor oath required. For personal study only.

✦ Synopsis

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

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