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Water splitting in low-temperature ac plasmas at atmospheric pressure

✍ Scribed by Jian Luo; Steven L. Suib; Yuji Hayashi; Hiroshige Matsumoto

Book ID
111759453
Publisher
Springer Netherlands
Year
2000
Tongue
English
Weight
991 KB
Volume
26
Category
Article
ISSN
0922-6168

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Using dielectric barrier discharges at atmospheric pressure, silicon wafers have been treated for lowtemperature direct wafer bonding with annealing temperatures down to 100 Β°C. The experimental setup and the bond procedure are described and the influences of different experimental parameters, such