✦ LIBER ✦

Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies

✍ Scribed by Ming-Fang Lai; Shih-Wei Li; Jian-Yu Shih; Kuan-Neng Chen

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Integration schemes and enabling technol

✍ Chen, K.N.; Tan, C.S. 📂 Article 📅 2011 🏛 The Institution of Engineering and Technology 🌐 English ⚖ 544 KB

Wafer bonding with nano-imprint resists

✍ Frank Niklaus; Adit Decharat; Fredrik Forsberg; Niclas Roxhed; Martin Lapisa; Mi 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 894 KB

Processing assessment and adhesion evalu

✍ Y. Yang; R. Labie; F. Ling; C. Zhao; A. Radisic; J. Van Olmen; Y. Travaly; B. Ve 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 677 KB

[IEEE The 2005 Wireless and Microwave Te

✍ Hella, M.M.; Devarajan, S.; Lu, J.-Q.; Rose, K.; Gutmann, R.J. 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 196 KB

[IEEE 2012 IEEE Computer Society Annual

✍ Luo, Pei-Wen; Wang, Tao; Wey, Chin-Long; Cheng, Liang-Chia; Sheu, Bih-Lan; Shi, 📂 Article 📅 2012 🏛 IEEE ⚖ 652 KB