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Wafer bonding: Investigation and in situ observation of the bond process

✍ Scribed by Christine Harendt; Heinz-Gerd Graf; Elisabeth Penteker; Bernd Höfflinger

Book ID
108028039
Publisher
Elsevier Science
Year
1990
Tongue
English
Weight
966 KB
Volume
23
Category
Article
ISSN
0924-4247

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✍ Hongjun Ji; Mingyu Li; Chunqing Wang; Han Sur Bang; Hee Seon Bang 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 888 KB

Interconnection joints are the signal and power carriers for chip-to-package, and their electrical property determines the whole component/device performances. With the process parameters (P, F and t) varying, the bond resistance was in situ measured during ultrasonic bonding. The influence of the p