Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
✍ Scribed by N. Zhao; X.M. Pan; D.Q. Yu; H.T. Ma; L. Wang
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 469 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We
## Abstract The concentration‐dependent variation of the surface tension and viscosity of Sn–X (X = Ag, Bi, In and Zn) liquid alloys has been theoretically investigated. The grand partition function for the surface has been solved in the framework of quasi‐lattice approximations to obtain analytica