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Use of WNX as the diffusion barrier for interconnect copper metallization of InGaP-GaAs HBTs

โœ Scribed by Shang-Wen Chang; Chang, E.Y.; Cheng-Shih Lee; Ke-Shian Chen; Chao-Wei Tseng; Tung-Ling Hsieh

Book ID
114617470
Publisher
IEEE
Year
2004
Tongue
English
Weight
371 KB
Volume
51
Category
Article
ISSN
0018-9383

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