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Ultra-low dielectric constant porous silica thick films for high-speed IC packaging

✍ Scribed by Mohideen, U.; Gururaja, T.R.; Cross, L.E.; Roy, R.

Book ID: 117872600
Publisher: IEEE
Year: 1988
Tongue: English
Weight: 495 KB
Volume: 11
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.2980

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