Tribology of Abrasive Machining Processes

✍ Scribed by Marinescu, Joan D.; Rowe, W. Brian; Dimitrov, Boris; Inasaki, Ichiro

• Publisher: William Andrew Publishing
• Year: 2004
• Tongue: English
• Leaves: 763
• Category: Library

✦ Synopsis

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

✦ Table of Contents

Content:
• Front Matter
• Preface
• Table of Contents
1. Introduction
2. Tribosystems of Abrasive Machining Processes
3. Kinematic Models of Abrasive Contacts
4. Contact Mechanics
5. Forces, Friction, and Energy
6. Thermal Design of Processes
7. Molecular Dynamics for Abrasive Process Simulation
8. Fluid Delivery
9. Electrolytic In-process Dressing (ELID) Grinding and Polishing
10. Grinding Wheel and Abrasive Topography
11. Abrasives and Abrasive Tools
12. Conditioning of Abrasive Wheels
13. Loose Abrasive Processes
14. Process Fluids for Abrasive Machining
15. Tribochemistry of Abrasive Machining
16. Processed Materials
Symbols and Units
• Glossary
• Index