Transmission property of flip chip package with adhesive interconnection for RF applications

✍ Scribed by Jong-Woong Kim; Wansoo Nah; Seung-Boo Jung

• Book ID: 104052077
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 813 KB
• Volume: 86
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.10.012