✦ LIBER ✦
Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip–chip interconnection
✍ Scribed by Myung Jin Yim; Woonseong Kwon; Kyung Wook Paik
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 563 KB
- Volume
- 126
- Category
- Article
- ISSN
- 0921-5107
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