✦ LIBER ✦
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives
✍ Scribed by Xiaowu Zhang; E.H. Wong; Ranjan Rajoo; Mahadevan K. Iyer; J.F.J.M. Caers; X.J. Zhao
- Book ID
- 108210499
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 456 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0026-2714
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