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Toward the formation of three-dimensional nanostructures by electrochemical etching of silicon

✍ Scribed by Kleimann, P.; Badel, X.; Linnros, J.

Book ID
120301634
Publisher
American Institute of Physics
Year
2005
Tongue
English
Weight
646 KB
Volume
86
Category
Article
ISSN
0003-6951

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Different processes involving an inductively coupled plasma reactor are presented either for deep reactive ion etching or for isotropic etching of silicon. On one hand, high aspect ratio microstructures with aspect ratio up to 107 were obtained on sub-micron trenches. Application to photonic MEMS is