TLP bonding of SiCp/2618Al composites using mixed Al–Ag–Cu system powders as interlayers

✍ Scribed by Jihua Huang; Yun Wan; Hua Zhang; Xingke Zhao

• Book ID: 106393456
• Publisher: Springer
• Year: 2007
• Tongue: English
• Weight: 388 KB
• Volume: 42
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-007-2016-9