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Pulse current auxiliary TLP diffusion bonding of SiCp/2024Al composite sheet using mixed Al–Cu–Ti powder interlayer

✍ Scribed by B. Wang, S. S. Jiang, K. F. Zhang


Book ID
120742324
Publisher
Springer
Year
2012
Tongue
English
Weight
341 KB
Volume
65
Category
Article
ISSN
0268-3768

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