Interface structure and mechanical performance of TLP bonded joints of Al2O3p/6061Al composites using Cu/Ni composite interlayers

✍ Scribed by Jiuchun Yan; Zhiwu Xu; Gaohui Wu; Shiqin Yang

• Book ID: 113895043
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 485 KB
• Volume: 51
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2004.03.036