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The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

✍ Scribed by Yan Jiuchun; Xu Zhiwu; Wu Gaohui; Yang Shiqin

Publisher: Springer
Year: 2005
Tongue: English
Weight: 206 KB
Volume: 40
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-005-4394-1

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